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iPhone 3G: Impossibly Thin (Just Like Your Wallet After Visiting the Apple Store)

April 10, 2008 at 9:40 am PT

In the run-up to Apple’s (AAPL) Worldwide Developer’s Conference in June, the Mac faithful are sifting entrails for portents of iPhones to come.

Yesterday the creators of the popular ZiPhone jailbreak discovered in the latest test firmware for iPhone developers a reference to Infineon’s (IFX) SGOLD3H chipset–a chipset that supports 3G wireless broadband of up to 7.2 Mbit/s.

Now “industry sources” cited by TG Daily are claiming that the next-gen iPhone that runs on that chip will debut at WWDC. And there’s more. The device will be slimmer than its predecessor (by about 2.5 mm) and it will be offered in least two configurations at current price points: an 8GB version for $399 and a 16GB $499.

Tagged with: Apple, broadband, chips, firmware, gigabyte, Infineon, iPhone, jailbreaking, John Paczkowski, Mac, multitouch, price, screen, SDK, SGOLD3H, software, wireless, Worldwide Developers Conference, WWDC

comments so far. Add yours.

http://djksar.wordpress.com Randy Ksar

oh my…Postponing iPhone purchase till June..dang it..I’ve been postponing every few months till the latest and greatest comes out — I hate high-tech! However, I do love the pay-check!
carlos trujillo

yeah 3g is great but what about the 32gig iphone, when is it comming out, are there any clues about it?
brian guess

What? No comment on the picture? The iPhone there is all black! It looks like crap compared to the current iPhone. Is this a legit picture or…? Any evidence of what the iPhone 2.0 case will look like?
http://digitaldaily.allthingsd.com John Paczkowski

The picture is a Photoshop/ColorWare creation, I think. I’ve no idea what the next-gen housing will look like, though there are rumors that it will be all black.
brian guess

@John – thank God, you’re right. The same picture can be found at ColorWare’s site. I much rather prefer the same case as the existing one (but now even thinner)! Thanks for confirming. Phew!