Elpida Unveils Thinnest Mobile Chip Package

Published on June 22, 2011
by Juro Osawa

Elpida Memory Inc. said Wednesday that it has developed a memory chip package that is 20 percent thinner than similar packages on the market, a breakthrough that the company says will help make mobile gadgets thinner while maintaining their memory capacity.

Elpida — Japan’s only maker of dynamic random access memory, or DRAM, chips — said the new one-gigabyte package containing four stacked chips is the world’s thinnest DRAM package of its kind. The chip package, designed for smartphones and other mobile devices, is 0.8 millimeter thick, compared with existing similar packages that are one millimeter thick, the company said.

Elpida plans to start mass producing and shipping the new chip package from the July-September quarter.

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