What's Behind the iPhone 3G Glitches

Complaints over dropped calls and choppy Web connections on Apple’s iPhone 3G have sparked a wave of debate in the blogosphere over the root cause of the problems. Two well-placed sources tell BusinessWeek.com the glitches are related to a chip inside Apple’s music-playing cell phone. The sources add that Apple (AAPL) plans to remedy the problems through a software upgrade rather than through a more disruptive step, such as a product recall.

The news reinforces analysis by Richard Windsor of Nomura Securities, who said in an Aug. 12 report that the problem involves a communications chip made by Munich-based Infineon Technologies (IFX). Faulty software on the chip causes problems when the iPhone needs to switch from wireless networks that allow for faster Web downloads to slower ones, the people say.

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  • http://allthingsd.com/ Michael Long

    This is the same Richard Windsor who described in great detail how the original iPhone touch screen was failing due to constant use rubbing off the heat sensitive coating on the glass. A known flaw, it was said, of the Finnish technology used.

    Only the iPhone has no heat sensitive coating on the glass, uses capacitance and not heat, and basically doesn’t use the Finnish technology at all.

    That Richard Windsor?

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